Thermal Grease CPU HeatSink Compound Paste syringe b21
1x Heatsink compound
High conductivity, low bleed, stable at high temperatures.
| Type: silicone fluid with 20% metal oxide.
| Thermal conductivity: >1.829 W/m-k.
| Thermal resistance: >0.123 C-in2/w.
| Dielectric breakdown: >5.0 KV ac.
| Weight of each tube: 1g.
| Color: white.
| Suitable for CPU, VGA.
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